- Operations Team Leader · Aug 2002 to Apr 2009Industry leader in RF power measurement and management. Manufacturer of power meters, antenna monitors, dummy loads, attenuators, watt meters, site analyzers. Thin and thick film ink processes. Responsible for starting production of new facility and directing all work and daily plant operations.
- Green and RoHS Compliance Initiative2007 to 2008Identify non-compliance inventory. Identify potential conforming replacement parts. Perform testing on new complaint parts.
- Transfer factory to new locationAug 2002 to Oct 2002Documented manufacturing assets and processes. Began new production out of state, hired new personnel and managed day to day facility operations.
- 2nd Shift Plant Manager · Jul 1999 to Sep 2001 · Churchville, New YorkSupplier of copper plated circuits on to ceramic substrates. Additionally, performed solder masks,wire bonding and SMT operations. Managed production through wet processes, clean rooms, assembly and inspection.
- ISO CertificationDec 1999 to Mar 2000Provided rough draft and review of documentation on various ISO elements as they apply to production, quality, and business processes.
- MRP software system updateSep 1999 to Nov 1999Assisted with updating the companies ERP/MRP sofware system to 4th Shift software. Entered data for Bills of Materials and other Engineering and planning functions.
- Surface Mount machine Technician · Mar 1996 to Feb 1999 ·Columbus, OhioSMT manufacturing, Hi speed population of electronic components on to circuit boards via computer/software controlled machines.
- Reduce Surface Mount Machine Run Time and Change Overs
- Statistical Data Collection Shop Floor Project
- Electronic Assembler · Jan 1996 to Jul 1996 · Dublin, OhioMain duties include building mobile nodes of modems and processor boards with fans. Supply all needed cabling and documentation and software for customers online access. Received and expedited customer orders and evaluate for completeness.
- On Time Delivery
Printed circuit board assemblies or (PCBA) are made up of the substrate with conductor pattern, solder mask, optional surface finishes, components and solder.
Thursday, January 26, 2012
Resume of Dave Kearns
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